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MBRD10200CT-13 - Diodes Incorporated

Description: Schottky Diodes & Rectifiers 10A Dual SBR 200Vrrm 110Ifsm 0.91

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MBRD10200CT-13 - Diodes Incorporated - PCB symbol
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MBRD10200CT-13 - Diodes Incorporated PCB footprint - Other - Other - MBRD10200CT-13-4
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MBRD10200CT-13 - Diodes Incorporated - 3D model - Other - MBRD10200CT-13-4
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MBRD10200CT-13 Details

  • Manufacturer Part Number:

    MBRD10200CT-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.91 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRD10200CT-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MBRD10200CT-13 is a standard SOD-123 package footprint with a pad size of 1.3mm x 1.3mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow the recommended derating curves for the device, ensure good thermal design and heat sinking, and consider using a thermally conductive interface material to improve heat transfer.
  • Yes, the MBRD10200CT-13 can be used in switching regulator applications, but it is recommended to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.
  • To protect the MBRD10200CT-13 from EOS, it is recommended to use a transient voltage suppressor (TVS) or a zener diode in parallel with the device, and to ensure that the device is operated within its recommended voltage and current ratings.
  • Yes, the MBRD10200CT-13 can be used in high-frequency applications, but it is recommended to ensure that the device is operated within its recommended frequency range and that the PCB layout is optimized for high-frequency operation.

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MBRD10200CT-13 Overview

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