The recommended PCB footprint for the MBRD10200CT is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum allowable voltage stress for the MBRD10200CT is 1.5 times the rated voltage, but not exceeding 100V. Prolonged exposure to high voltage stress can reduce the component's lifespan.
The MBRD10200CT is rated for operation up to 150°C, but its performance may degrade at high temperatures. Ensure that the component is properly derated for high-temperature applications.
Handle the MBRD10200CT with ESD-protective equipment and follow proper ESD-handling procedures to prevent damage to the component.
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MBRD10200CT Overview
Use the download button to access the MBRD10200CT 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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