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MBRD1035CTLT4G - onsemi

Description: Short Heat Sink Tap Manufactured - Not Sheared; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Very Low Forward Voltage Drop; Weight: 0.4 gram (approximately); Available in 16 mm Tape and Reel, 2500 units per Reel, Add "T4'' to Suffix part #; Marking: B1035CL; Guardring for Stress Protection; Matched dual die construc

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MBRD1035CTLT4G - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE G_2025_1
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MBRD1035CTLT4G - onsemi  - 3D model - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE G_2025_1
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MBRD1035CTLT4G Details

  • Manufacturer Part Number:

    MBRD1035CTLT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Mainland China, Malaysia, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    35 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.56 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    35 V

  • Reverse Current-Max:

    2000 µA

  • Reverse Test Voltage:

    35 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRD1035CTLT4G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern is recommended. Refer to the onsemi application note AND9093/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-55°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Monitor the device's junction temperature (TJ) and ensure it does not exceed 150°C.
  • The MBRD1035CTLT4G has an integrated ESD protection diode. However, it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • Yes, the MBRD1035CTLT4G is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure compliance with the relevant industry standards. However, it is recommended to consult with onsemi's application engineers to ensure that the device meets the specific requirements of your application.
  • Consult the onsemi troubleshooting guide AND9094/D for common issues and solutions. Perform a visual inspection of the device and PCB for signs of damage or contamination. Use a thermal imaging camera to check for thermal anomalies. Consult with onsemi's technical support team if the issue persists.

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MBRD1035CTLT4G Overview

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