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MBRD6100CT-TP - MCC

Description: Schottky Barrier Rectifiers ,DPAK -252,IF(AV)(A):6 , VRWM (V):100,VR (V):100 ,Tj [max] (°C):150 .

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MBRD6100CT-TP - MCC PCB footprint - Other - Other - MBRD6100CT-TP-1
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MBRD6100CT-TP - MCC  - 3D model - Other - MBRD6100CT-TP-1
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MBRD6100CT-TP Details

  • Manufacturer Part Number:

    MBRD6100CT-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.22

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.74 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    78 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

MBRD6100CT-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the device on a 2-layer or 4-layer board with a solid ground plane, and using thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management.
  • The device requires a stable input voltage and proper biasing of the input and output pins. Refer to the application notes and evaluation board schematics for guidance on proper configuration and biasing.
  • The device is designed to operate in industrial temperature ranges (-40°C to 125°C) and is qualified to meet the requirements of AEC-Q101. However, the actual reliability and durability will depend on the specific application and environmental conditions.
  • Yes, the device is sensitive to electrostatic discharge (ESD). Handle the device with ESD-safe materials, and follow proper ESD protection procedures during assembly and testing.
  • The device is designed for low-frequency and low-power applications. For high-frequency or high-power applications, consider using a different device or consulting with a Micro Commercial Components application engineer for guidance.

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MBRD6100CT-TP Overview

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