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MBRD640CTG - onsemi

Description: SCHOTTKY BARRIER RECTIFIERS 6.0 AMPERES, 20 − 60 VOLTS

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PCB Footprints
MBRD640CTG - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE G40CTG-2
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MBRD640CTG Details

  • Manufacturer Part Number:

    MBRD640CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    40 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRD640CTG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRD640CTG is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a thermally conductive material to improve heat dissipation.
  • A recommended PCB layout for the MBRD640CTG includes a thermal pad connected to a large copper area on the PCB, and using thermal vias to dissipate heat. Consult the onsemi application note for more details.
  • Yes, the MBRD640CTG is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper PCB layout and decoupling to minimize parasitic inductance and capacitance.
  • Handle the MBRD640CTG with ESD-protective equipment, and ensure that the PCB design includes ESD protection circuits, such as TVS diodes or ESD protection arrays.

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MBRD640CTG Overview

Use the download button to access the MBRD640CTG schematic symbol and PCB footprint.
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For a full list of alternate parts for MBRD640CTG, check out Findchips.com