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MBRF20100CTG - onsemi

Description: Case: Epoxy, Molded; Electrically Isolated. No Isolation Hardware Required.; High dv/dt Capability; Matched Dual Die Construction; Weight: 1.9 grams (approximately); High Junction Temperature Capability; Guardring for Stress Protection; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Marking: B20100; Lead Temperature for Solde

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MBRF20100CTG - onsemi - PCB symbol
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PCB Footprints
MBRF20100CTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 FULLPAK CASE 221D-03
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3D Models
MBRF20100CTG - onsemi - 3D model - Transistor Outline, Vertical - TO-220 FULLPAK CASE 221D-03
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