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MBRF20100CTG - onsemi

Description: Case: Epoxy, Molded; Electrically Isolated. No Isolation Hardware Required.; High dv/dt Capability; Matched Dual Die Construction; Weight: 1.9 grams (approximately); High Junction Temperature Capability; Guardring for Stress Protection; Highly Stable Oxide Passivated Junction; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Marking: B20100; Lead Temperature for Solde

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MBRF20100CTG - onsemi - PCB symbol
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PCB Footprints
MBRF20100CTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 FULLPAK CASE 221D-03
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3D Models
MBRF20100CTG - onsemi - 3D model - Transistor Outline, Vertical - TO-220 FULLPAK CASE 221D-03
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MBRF20100CTG Details

  • Manufacturer Part Number:

    MBRF20100CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220 3 LEAD FULLPAK

  • Pin Count:

    3

  • Manufacturer Package Code:

    221D-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.82

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MBRF20100CTG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRF20100CTG is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • Yes, the MBRF20100CTG is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly bypassed and decoupled to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • To protect the MBRF20100CTG from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the device is stored in an anti-static bag or container. Additionally, use ESD-sensitive handling procedures during assembly and testing.
  • The recommended PCB layout for the MBRF20100CTG involves using a thermal pad and thermal vias to dissipate heat. A heat sink or thermal interface material can also be used to improve thermal performance. Ensure that the PCB layout is designed to minimize thermal resistance and maximize heat dissipation.

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MBRF20100CTG Overview

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