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MBRF20H150CTG - onsemi

Description: Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 20 A Total (10 A Per Diode Leg); Guard-Ring for Stress Protection; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams (TO-220 & TO-220FP); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

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PCB Footprints
MBRF20H150CTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 FULLPAK CASE 221D-03
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3D Models
MBRF20H150CTG - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 FULLPAK CASE 221D-03
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MBRF20H150CTG Details

  • Manufacturer Part Number:

    MBRF20H150CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220 3 LEAD FULLPAK

  • Pin Count:

    3

  • Manufacturer Package Code:

    221D-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    180 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

MBRF20H150CTG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRF20H150CTG is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a thermal interface material to improve heat dissipation.
  • A recommended PCB layout for the MBRF20H150CTG includes a thermal pad connected to a large copper area on the PCB, with multiple vias to dissipate heat. A thermal interface material can also be used to improve heat transfer.
  • Yes, the MBRF20H150CTG can be used in high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the PCB layout.
  • To handle power dissipation, ensure proper thermal management by using a heat sink, thermal interface material, and a PCB design that allows for efficient heat dissipation. Additionally, consider using a current sense resistor to monitor current and prevent overheating.

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MBRF20H150CTG Overview

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