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MBRS3201T3G - onsemi

Description: Highly Stable Over Temperature; Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.59 V at 150C; Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns; Soft Recovery Characteristics: Softness Factor (tb/ta) < 1; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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PCB Footprints
MBRS3201T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
MBRS3201T3G - onsemi  - 3D model - Diodes Moulded - SMC CASE403-03
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MBRS3201T3G Details

  • Manufacturer Part Number:

    MBRS3201T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST SOFT RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.59 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRS3201T3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MBRS3201T3G involves keeping the input and output traces separate, using a ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing a capacitor between the input and output can help reduce EMI.
  • To ensure the MBRS3201T3G operates within its SOA, monitor the device's voltage, current, and power dissipation. Ensure the input voltage is within the recommended range, and the output current is within the maximum rating. Also, provide adequate heat sinking to prevent overheating.
  • The recommended input capacitor value for the MBRS3201T3G is typically in the range of 10uF to 22uF, with a voltage rating of at least 25V. However, the optimal value may vary depending on the specific application and input voltage ripple requirements.
  • The MBRS3201T3G is rated for operation up to 150°C, but its performance and reliability may degrade at high temperatures. Ensure proper heat sinking and consider derating the device's power handling capabilities at elevated temperatures.
  • To troubleshoot issues with the MBRS3201T3G, start by verifying the input voltage, output voltage, and current. Check for overheating, incorrect PCB layout, or inadequate heat sinking. Use an oscilloscope to inspect the input and output waveforms for signs of oscillation or instability.

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MBRS3201T3G Overview

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