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MBRS320T3G - onsemi

Description: Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Weight: 217 mg (approximately); Marking: B32, B33, B34; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Polarity: Notch

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PCB Footprints
MBRS320T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
MBRS320T3G - onsemi  - 3D model - Diodes Moulded - SMC CASE403-03
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MBRS320T3G Details

  • Manufacturer Part Number:

    MBRS320T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    20 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    2000 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRS320T3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRS320T3G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • Yes, the MBRS320T3G is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly decoupled and that the layout is optimized to minimize parasitic inductance and capacitance.
  • Consider the thermal characteristics of the MBRS320T3G during design and layout. Ensure that the device has adequate heat sinking, and that the PCB layout is optimized to minimize thermal resistance. Use thermal simulation tools to validate the design.
  • Follow the recommended PCB layout guidelines for the MBRS320T3G, including using a solid ground plane, minimizing track lengths, and using a thermal relief pattern for the device's thermal pad.

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MBRS320T3G Overview

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Part Image MBRS320_NL Fairchild Semiconductor Corporation

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Part Image MBRS320-G Sangdest Microelectronics (Nanjing) Co Ltd

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Part Image SK32 International Semiconductor Inc

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For a full list of alternate parts for MBRS320T3G, check out Findchips.com