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MBRS330T3G - onsemi

Description: Case: Epoxy, Molded; Small Compact Surface Mountable Package with J-Bend Leads; Shipped in 16 mm Tape and Reel, 2500 units per reel; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Stress Protection Mechanical Characteristics:; Weight: 217 mg (approximately); Marking: B32, B33, B34; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Polarity: Notch

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PCB Footprints
MBRS330T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
MBRS330T3G - onsemi  - 3D model - Diodes Moulded - SMC CASE403-03
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MBRS330T3G Details

  • Manufacturer Part Number:

    MBRS330T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    2000 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRS330T3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRS330T3G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • Yes, the MBRS330T3G is suitable for high-frequency switching applications due to its low capacitance and fast switching times. However, ensure that the device is properly decoupled and that the PCB layout is optimized for high-frequency operation.
  • The MBRS330T3G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Store the MBRS330T3G in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, and the relative humidity should be below 60%.

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MBRS330T3G Overview

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Rectifier Diode, Schottky, 1 Phase, 1 Element, 4A, 30V V(RRM), Silicon, DO-214AB

Part Image NRVBS330T3G onsemi

Rectifier Diode, Schottky, 1 Phase, 1 Element, 4A, 30V V(RRM), Silicon