Description:Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal relief pattern can be used to improve thermal performance.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Also, consider using a heat sink or thermal interface material to reduce thermal resistance. Finally, follow proper PCB design and layout guidelines to minimize thermal resistance.
A soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux, and the PCB should be cleaned after soldering to prevent corrosion.
The MBRS360BT3G has built-in ESD protection, but additional protection measures can be taken. Use an ESD wrist strap or mat when handling the device, and ensure that the PCB is designed with ESD protection in mind, such as using ESD-protection diodes or resistors.
Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, not the leads, to prevent damage. Use anti-static packaging and follow proper ESD handling procedures to prevent damage.
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MBRS360BT3G Overview
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