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MBRS360T3G - onsemi

Description: Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Excellent Ability to Withstand Reverse Avalanche Energy Transients; Guardring for Stress Protection Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL94, VO; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max

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MBRS360T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE A
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MBRS360T3G - onsemi  - 3D model - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE A
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MBRS360T3G Details

  • Manufacturer Part Number:

    MBRS360T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.63 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    125 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRS360T3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRS360T3G is -55°C to 150°C.
  • To ensure proper biasing, connect the anode to a voltage source through a current-limiting resistor, and connect the cathode to ground through a low-impedance path. Consult the datasheet for specific biasing requirements.
  • Store the MBRS360T3G in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to temperatures above 30°C or humidity above 60%.
  • Yes, the MBRS360T3G is suitable for high-reliability applications. It is designed to meet the stringent requirements of the aerospace and automotive industries, and is qualified to relevant industry standards.
  • Handle the MBRS360T3G with ESD-protective equipment, such as wrist straps or mats, and avoid touching the device's pins or leads. Ground yourself before handling the device, and avoid walking or sliding on carpets or other static-generating surfaces.

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MBRS360T3G Overview

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For a full list of alternate parts for MBRS360T3G, check out Findchips.com