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MBRS540PT3G - onsemi

Description: Obsolete - Schottky Power Rectifier, Surface Mount, 5.0 A, 40 V

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Symbol
MBRS540PT3G - onsemi - PCB symbol
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PCB Footprints
MBRS540PT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE B
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3D Models
MBRS540PT3G - onsemi - 3D model - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE B
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MBRS540PT3G Details

  • Manufacturer Part Number:

    MBRS540PT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SMC-2

  • Package Description:

    SMC, 2 PIN

  • Manufacturer Package Code:

    403AC

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    190 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    300 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRS540PT3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRS540PT3G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • The recommended land pattern for the MBRS540PT3G is a rectangular pad with a minimum size of 1.5 mm x 2.5 mm, with a 0.5 mm radius corner. The pad should be centered on the device and have a solder mask defined pad (SMDP) with a minimum clearance of 0.2 mm.
  • Yes, the MBRS540PT3G is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the circuit, and to use a suitable PCB layout and component selection to minimize signal degradation.
  • To manage the thermal performance of the MBRS540PT3G, ensure good thermal conductivity between the device and the PCB, use a thermal interface material (TIM) if necessary, and consider using a heat sink or thermal management system if the device is expected to operate at high temperatures or high power levels.

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MBRS540PT3G Overview

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