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MC01W08051270K - Multicomp Pro

Description: MULTICOMP - MC01W08051270K - RES, 270K, 1%, 0.1W, 0805, THICK FILM

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PCB Footprints
MC01W08051270K - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MC01W0805
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3D Models
MC01W08051270K - Multicomp Pro  - 3D model - Resistor Chip - MC01W0805
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MC01W08051270K Details

  • Manufacturer Part Number:

    MC01W08051270K

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    0

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    270000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

MC01W08051270K Frequently Asked Questions (FAQs)

  • The recommended storage condition for MC01W08051270K is to store it in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 70%. This helps prevent moisture absorption and ensures the component's reliability.
  • While the MC01W08051270K is a robust component, it's essential to consider the vibration specifications in your application. The component can withstand moderate vibrations, but extreme vibrations may affect its performance. Consult with the manufacturer or a qualified engineer to determine the suitability of MC01W08051270K for your specific application.
  • To prevent damage during soldering, ensure the component is handled by the edges, avoiding touching the pins or the component body. Use a soldering iron with a temperature below 260°C, and avoid applying excessive force or pressure. Follow the recommended soldering profile and handling guidelines to ensure the component's reliability.
  • The recommended cleaning process for MC01W08051270K involves using a mild detergent and deionized water. Avoid using harsh chemicals, abrasive materials, or ultrasonic cleaning, as these can damage the component's surface or compromise its performance.
  • While the MC01W08051270K is designed to operate in a variety of environments, it's not recommended for applications with high humidity or moisture. The component's performance and reliability may be affected in such conditions. If your application requires operation in humid or moist environments, consider using a component with specific humidity or moisture resistance ratings.

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MC01W08051270K Overview

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Part Image TRR10EZPF2703 ROHM Semiconductor

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