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MC01W08051390R - Multicomp Pro

Description: MULTICOMP - MC01W08051390R - RES, THICK FILM, 390R, 1%, 0.1W, 0805

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Symbol
MC01W08051390R - Multicomp Pro - PCB symbol
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PCB Footprints
MC01W08051390R - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MC01W0805
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3D Models
MC01W08051390R - Multicomp Pro - 3D model - Resistor Chip - MC01W0805
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MC01W08051390R Details

  • Manufacturer Part Number:

    MC01W08051390R

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    0

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    390 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

MC01W08051390R Frequently Asked Questions (FAQs)

  • The recommended land pattern for MC01W08051390R is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the MC01W08051390R is rated for operation up to 150°C, it's essential to consider the derating curve and ensure the component doesn't exceed its maximum power rating at elevated temperatures. Consult the datasheet and manufacturer's guidelines for specific temperature-related considerations.
  • The MC01W08051390R is a moisture-sensitive device (MSD). To prevent damage, store the components in a dry environment (less than 30% relative humidity) and follow the manufacturer's recommended baking and handling procedures before soldering.
  • The recommended soldering profile for MC01W08051390R is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure the soldering process is within the manufacturer's specified guidelines to prevent damage to the component.
  • Yes, the MC01W08051390R is compatible with lead-free soldering processes. However, ensure the soldering profile and materials meet the manufacturer's guidelines and industry standards for lead-free soldering.

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MC01W08051390R Overview

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MC01W08051390R Alternates

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Part Image CR0805F-390RFI TT Electronics Resistors

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 390ohm, 100V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
Part Image CR0805F-390RFI TT Electronics Welwyn Components

RESISTOR, METAL GLAZE/THICK FILM, 0.125W, 1%, 100ppm, 390ohm, SURFACE MOUNT, 0805, CHIP, LEAD FREE
Part Image RMC20K391FB Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 390ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
Part Image RMC1/10K3900FB Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 390ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805
Part Image MCR10EZHF3900 ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 390ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805
For a full list of alternate parts for MC01W08051390R, check out Findchips.com