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MC0805S8F2000T5E - Multicomp Pro

Description: MULTICOMP PRO - MC0805S8F2000T5E - RES, THICK FILM, 200R, 1%, 0.125W, 0805

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MC0805S8F2000T5E - Multicomp Pro - PCB symbol
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PCB Footprints
MC0805S8F2000T5E - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - 0805_2022
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3D Models
MC0805S8F2000T5E - Multicomp Pro - 3D model - Resistor Chip - 0805_2022
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MC0805S8F2000T5E Details

  • Manufacturer Part Number:

    MC0805S8F2000T5E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

MC0805S8F2000T5E Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MC0805S8F2000T5E is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the MC0805S8F2000T5E is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the PCB material and soldering process should be suitable for high-temperature applications.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 270°C, and apply a small amount of solder paste or flux. The soldering time should be around 2-3 seconds, and the component should be placed on a flat, clean surface. Avoid applying excessive force or pressure during soldering.
  • Yes, the MC0805S8F2000T5E is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and ensure that the soldering process is optimized for lead-free soldering.
  • The typical tolerance for the MC0805S8F2000T5E's capacitance value is ±20%. This means that the actual capacitance value may vary by up to 20% from the nominal value of 2000pF.

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MC0805S8F2000T5E Overview

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Part Image 0805S8F2000CD Royal Electronic Factory (Thailand) Co Ltd

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