The recommended land pattern for the MC0805S8F6801T5E is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the MC0805S8F6801T5E is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the PCB material and soldering process should be suitable for high-temperature applications.
To prevent damage, handle the MC0805S8F6801T5E by the edges, avoid touching the component's surface, and use an anti-static wrist strap or mat. During PCB assembly, ensure that the component is properly aligned and seated on the PCB to prevent mechanical stress.
The recommended soldering profile for the MC0805S8F6801T5E is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of component damage.
While the MC0805S8F6801T5E is not specifically designed for humid or moist environments, it can still be used in such conditions with proper precautions. Ensure that the PCB is properly coated with a conformal coating, and consider using a moisture-resistant packaging material.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MC0805S8F6801T5E Overview
Use the download button to access the MC0805S8F6801T5E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC080,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
