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MC100EL07DR2G - onsemi

Description: ESD Protection: > 1 KV HBM, > 100 V MM; NECL Mode Operating Range: VCC= 0 V with VEE= -4.2 V to -5.7 V; PECL Mode Operating Range: VCC= 4.2 V to 5.7 V with VEE= 0 V; 260ps Propagation Delay; Internal Input Pulldown Resistors; Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test; Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D; Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34; Transistor Count = 47 devices; Pb-Free Packages are Available

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MC100EL07DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC100EL07DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC100EL07DR2G Details

  • Manufacturer Part Number:

    MC100EL07DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Additional Feature:

    NECL MODE: VCC =0V WITH VEE = -4.2V TO -5.7V

  • Family:

    100EL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    XOR/XNOR GATE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    20 mA

  • Prop. Delay@Nom-Sup:

    0.435 ns

  • Propagation Delay (tpd):

    0.395 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.7 V

  • Supply Voltage-Min (Vsup):

    4.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC100EL07DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100EL07DR2G should minimize signal trace lengths, use 50-ohm impedance matching, and provide adequate power supply decoupling. It's also recommended to use a solid ground plane and to keep the device away from noise sources.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device within its recommended operating temperature range.
  • The MC100EL07DR2G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding personnel, and using ESD-protected workstations.
  • While the MC100EL07DR2G is optimized for 50-ohm systems, it can be used in non-50-ohm systems with proper impedance matching. However, this may require additional circuitry and may affect the device's performance and power consumption.
  • The recommended power supply decoupling capacitors for the MC100EL07DR2G are 0.1uF to 1uF ceramic capacitors with a voltage rating of at least 2.5V, placed as close as possible to the device's power pins.

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