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MC100ELT22DTG - onsemi

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MC100ELT22DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8 CASE948R-02 ISSUE A
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MC100ELT22DTG - onsemi  - 3D model - Small Outline Packages - TSSOP-8 CASE948R-02 ISSUE A
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MC100ELT22DTG Details

  • Manufacturer Part Number:

    MC100ELT22DTG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    948R-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Delay-Max:

    1.5 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    TTL/CMOS TO PECL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    22 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    ECL100K

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MC100ELT22DTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100ELT22DTG involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a low-ESR capacitor (e.g., 0.1 μF) between the VCC and GND pins to filter out noise.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. The input voltage (VIN) should be within the recommended range (typically 0.8V to 5.5V). Also, ensure that the input signal is properly terminated to prevent reflections and signal degradation.
  • The MC100ELT22DTG is specified to operate up to 2.5 GHz, but the actual frequency of operation may be limited by the specific application, PCB layout, and signal quality. It's recommended to consult the datasheet and application notes for more information on frequency planning and signal integrity.
  • The MC100ELT22DTG has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat when handling the device, and store it in an anti-static bag or container. Additionally, ensure that the PCB design includes adequate ESD protection measures, such as TVS diodes or ESD protection arrays.
  • The MC100ELT22DTG has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to maintain a safe operating temperature. Use thermal vias, thermal pads, or heat sinks to dissipate heat, and ensure good airflow around the device. Consult the datasheet for thermal resistance and power dissipation information.

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TTL/CMOS to PECL Translator, 2 Func, Complementary Output, ECL100K, PDSO8