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MC100ELT25DTG - onsemi

Description: -5 V Differential ECL to TTL Translator

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MC100ELT25DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−8 DT SUFFIX
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3D Models
MC100ELT25DTG - onsemi  - 3D model - Small Outline Packages - TSSOP−8 DT SUFFIX
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MC100ELT25DTG Details

  • Manufacturer Part Number:

    MC100ELT25DTG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    948R-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Delay-Max:

    4.1 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    ECL TO TTL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    -5.7 V

  • Supply Voltage1-Min:

    -4.2 V

  • Supply Voltage1-Nom:

    -5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MC100ELT25DTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100ELT25DTG involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To properly bypass the MC100ELT25DTG, use a 0.1uF ceramic capacitor between the VCC pin and the GND pin, and a 10uF electrolytic capacitor between the VCC pin and the GND pin. Place the capacitors as close to the device as possible, and use a low-ESR capacitor for the 10uF capacitor.
  • The maximum operating frequency of the MC100ELT25DTG is 2.5 GHz. However, the actual operating frequency may be limited by the specific application and the quality of the PCB layout.
  • The MC100ELT25DTG has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or a thermal pad on the exposed pad of the device, and ensure good airflow around the device. Also, avoid overheating the device during soldering and handling.
  • The MC100ELT25DTG has an ESD protection of 2kV human body model (HBM) and 100V machine model (MM). However, it's still recommended to handle the device with ESD precautions, such as using an ESD wrist strap or mat, and storing the device in an ESD-safe environment.

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MC100ELT25DTG Overview

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Part Image MC100ELT25DTR2 onsemi

ECL to TTL Translator, 1 Func, True Output, ECL, PDSO8