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MC100EP01DG - onsemi

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MC100EP01DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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MC100EP01DG - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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MC100EP01DG Details

  • Manufacturer Part Number:

    MC100EP01DG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

  • Family:

    100E

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    OR/NOR GATE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    38 mA

  • Prop. Delay@Nom-Sup:

    0.35 ns

  • Propagation Delay (tpd):

    0.33 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC100EP01DG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100EP01DG involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 3.3V power supply, and the GND pin to a solid ground plane. Also, ensure that the input signals are within the recommended voltage range (0.8V to 2.4V) and that the output is properly terminated with a 50Ω load.
  • The MC100EP01DG is capable of supporting data rates up to 3.2 Gbps, making it suitable for high-speed applications such as HDMI, DisplayPort, and PCIe.
  • The MC100EP01DG has a maximum junction temperature of 150°C. To ensure proper thermal management, make sure to provide adequate heat sinking, such as a thermal pad or a heat sink, and ensure good airflow around the device.
  • The MC100EP01DG has a human body model (HBM) ESD rating of 2 kV. To ensure proper ESD protection, it's recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines.

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MC100EP01DG Overview

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For a full list of alternate parts for MC100EP01DG, check out Findchips.com