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MC100LVEL29DWR2G - onsemi

Description: Flip Flop 2 Element D-Type 1 Bit Positive Edge 20-SOIC (0.295", 7.50mm Width)

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MC100LVEL29DWR2G - onsemi - PCB symbol
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PCB Footprints
MC100LVEL29DWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 20 WB CASE 751D-05
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3D Models
MC100LVEL29DWR2G - onsemi - 3D model - Small Outline Packages - SOIC 20 WB CASE 751D-05
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MC100LVEL29DWR2G Details

  • Manufacturer Part Number:

    MC100LVEL29DWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-20 WB

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    751D-05

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

  • Family:

    100LVEL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Logic IC Type:

    D FLIP-FLOP

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-EMITTER

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    7.5 mm

  • fmax-Min:

    1100 MHz

MC100LVEL29DWR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100LVEL29DWR2G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, connect the VCC pin to a stable 2.5V power supply, and the GND pin to a solid ground plane. Also, make sure to decouple the power supply with a 0.1uF capacitor and a 10uF capacitor in parallel, placed as close to the device as possible.
  • The MC100LVEL29DWR2G is specified to operate up to 2.5 GHz, but the actual maximum frequency of operation may vary depending on the specific application and PCB layout. It's recommended to consult with onsemi's application notes and simulation tools to determine the maximum frequency of operation for a specific design.
  • The MC100LVEL29DWR2G has a maximum junction temperature of 150°C. To ensure proper thermal management, it's recommended to use a heat sink or a thermal pad on the exposed pad of the device, and to keep the ambient temperature below 85°C. Also, make sure to follow the recommended PCB layout and thermal design guidelines from onsemi.
  • The MC100LVEL29DWR2G has an integrated ESD protection circuit, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from external ESD events.

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MC100LVEL29DWR2G Overview

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