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MC100LVEL30DWG - onsemi

Description: ON Semiconductor MC100LVEL30DWG Triple D Type Flip Flop IC, ECL, 3.3 → 3.8 V, 20-Pin SOIC

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MC100LVEL30DWG - onsemi - PCB symbol
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PCB Footprints
MC100LVEL30DWG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 20 WB CASE 751D-05
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3D Models
MC100LVEL30DWG - onsemi - 3D model - Small Outline Packages - SOIC 20 WB CASE 751D-05
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MC100LVEL30DWG Details

  • Manufacturer Part Number:

    MC100LVEL30DWG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    751D-05

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

  • Family:

    100LVEL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D FLIP-FLOP

  • Max Frequency@Nom-Sup:

    1200000000 Hz

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-EMITTER

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.82 ns

  • Propagation Delay (tpd):

    0.82 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    7.5 mm

  • fmax-Min:

    1200 MHz

MC100LVEL30DWG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100LVEL30DWG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing bypass capacitors close to the device. Additionally, it's recommended to use a low-impedance power supply and to minimize the number of vias and layer changes.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V power supply, and the VEE pin to a stable -3.3V power supply. The input common-mode voltage should be set to around 1.5V, and the output should be terminated with a 50Ω load to VCC/2. Additionally, ensure that the input signals are within the recommended common-mode voltage range.
  • The MC100LVEL30DWG is specified to operate up to 3.2 GHz, but the actual operating frequency may be limited by the specific application, PCB layout, and signal integrity. It's recommended to consult the datasheet and application notes for more information on frequency planning and signal integrity.
  • The MC100LVEL30DWG has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or thermal pad on the exposed pad of the device, and ensure good airflow around the device. Additionally, minimize the power consumption and reduce the ambient temperature to prevent overheating.
  • The MC100LVEL30DWG has a human body model (HBM) ESD rating of 2 kV and a machine model (MM) ESD rating of 200 V. To prevent ESD damage, handle the device with an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the device pins or exposed pads during handling.

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