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MC100LVEL91DWG - onsemi

Description: The 100 Series Contains Temperature Compensation; Q Output will Default LOW with Inputs Open or at GND; Operating Range: VCC = 3.8 V to 3.3 V; VEE = -3.0 V to -3.8 V; GND= 0 V; 620 ps Typical Propagation Delay; Pb-Free Packages are Available

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MC100LVEL91DWG - onsemi - PCB symbol
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PCB Footprints
MC100LVEL91DWG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−20 WB CASE 751D−05 ISSUE H
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MC100LVEL91DWG - onsemi - 3D model - Small Outline Packages - SOIC−20 WB CASE 751D−05 ISSUE H
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MC100LVEL91DWG Details

  • Manufacturer Part Number:

    MC100LVEL91DWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-20 WB

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    751D-05

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.87

  • Delay-Max:

    0.76 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    PECL TO ECL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    -5.5 V

  • Supply Voltage1-Min:

    -3 V

  • Supply Voltage1-Nom:

    -3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MC100LVEL91DWG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100LVEL91DWG involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper decoupling, place a 0.1uF ceramic capacitor between the VCC and GND pins, as close to the device as possible. Additionally, use a 10uF bulk capacitor between the power supply and the PCB's power plane to filter out noise and ripple.
  • The MC100LVEL91DWG is specified to operate up to 100 MHz, but it can be overclocked to higher frequencies with careful PCB design and layout. However, exceeding the recommended frequency may compromise the device's reliability and performance.
  • The MC100LVEL91DWG has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Keep the device's junction temperature below 150°C to ensure reliable operation.
  • The MC100LVEL91DWG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded.

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MC100LVEL91DWG Overview

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