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MC100LVELT23DR2G - onsemi

Description: 2.0ns Typical Propagation Delay; PECL Mode Operating Range: VCC= 3.0 V to 3.8 V with GND= 0 V; Maximum Frequency > 180 MHz; Flow Through Pinouts; Internal Pulldown Resistors; Differential LVPECL Inputs; 24 mA LVTTL Outputs; Q Output will default LOW with inputs open or at GND; ESD Protection: >1.5 KV HBM, >100 V MM; Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test; Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D; Flammability Rating: UL-94 code V-0 @ 1/8", Oxyge

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MC100LVELT23DR2G - onsemi - PCB symbol
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PCB Footprints
MC100LVELT23DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 NB(Thikness=1.75mm)
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MC100LVELT23DR2G - onsemi - 3D model - Small Outline Packages - SOIC−8 NB(Thikness=1.75mm)
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MC100LVELT23DR2G Details

  • Manufacturer Part Number:

    MC100LVELT23DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.6

  • Delay-Max:

    2.5 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LVPECL TO LVTTL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC100LVELT23DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100LVELT23DR2G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper decoupling, place a 0.1uF ceramic capacitor between the VCC pin and the GND pin, as close to the device as possible. Additionally, use a 10uF bulk capacitor between the power supply and the GND pin, located near the power supply.
  • The maximum operating frequency of the MC100LVELT23DR2G is 3.2 GHz. However, the actual operating frequency may be limited by the specific application and the quality of the PCB layout.
  • The MC100LVELT23DR2G has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) between the device and the heat sink or thermal plane.
  • The recommended input termination for the MC100LVELT23DR2G is 50 ohms, and the recommended output termination is 50 ohms in series with a 10pF capacitor. However, the actual termination may vary depending on the specific application and the transmission line impedance.

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MC100LVELT23DR2G Overview

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