NECL MODE OPERATING RANGE: VCC = 0V WITH VEE = -2.375V TO -3.8V
Family:
100LVE
Input Conditioning:
DIFFERENTIAL MUX
JESD-30 Code:
S-XQCC-N32
JESD-609 Code:
e3
Length:
5 mm
Logic IC Type:
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
32
Number of True Outputs:
10
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
HVQCCN
Package Equivalence Code:
LCC32,.2SQ,20
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Prop. Delay@Nom-Sup:
0.59 ns
Propagation Delay (tpd):
0.5 ns
Qualification Status:
Not Qualified
Same Edge Skew-Max (tskwd):
0.025 ns
Seated Height-Max:
1 mm
Supply Voltage-Max (Vsup):
3.8 V
Supply Voltage-Min (Vsup):
2.375 V
Supply Voltage-Nom (Vsup):
2.5 V
Surface Mount:
YES
Technology:
ECL
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
5 mm
MC100LVEP111MNG Frequently Asked Questions (FAQs)
A good PCB layout for the MC100LVEP111MNG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To properly bypass the MC100LVEP111MNG, use a 0.1uF ceramic capacitor between the VCC pin and the GND pin, and a 10uF electrolytic capacitor between the VCC pin and the GND pin. Place the capacitors as close to the device as possible, and use a low-ESR capacitor for the 10uF capacitor.
The MC100LVEP111MNG has an operating temperature range of -40°C to 125°C. However, the device's performance may degrade at temperatures above 85°C, and it's recommended to derate the device's power dissipation accordingly.
To handle thermal management, ensure good airflow around the device, and use a heat sink if necessary. The device's thermal pad should be connected to a solid ground plane to help dissipate heat. Avoid using thermal insulation materials that can reduce heat dissipation.
The MC100LVEP111MNG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MC100LVEP111MNG Overview
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