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MC100LVEP11DTR2G - onsemi

Description: Open Input Default State; 240 ps Typical Propagation Delay; Q Outputs will default LOW with inputs open or at VEE; Maximum Frequency > 3 GHz Typical; PECL Mode Operating Range: VCC= 2.375 V to 3.8 V with VEE= 0 V; NECL Mode Operating Range: VCC= 0 V with VEE= -2.375 V to -3.8 V; LVDS Input Compatible

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MC100LVEP11DTR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP 8 CASE 948R−02 ISSUE A
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MC100LVEP11DTR2G - onsemi  - 3D model - Small Outline Packages - TSSOP 8 CASE 948R−02 ISSUE A
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MC100LVEP11DTR2G Details

  • Manufacturer Part Number:

    MC100LVEP11DTR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP 8 3.0x3.0x0.95 mm

  • Pin Count:

    8

  • Manufacturer Package Code:

    948R-02

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Additional Feature:

    NECL MODE : VCC = 0V WITH VEE = -2.375V TO -3.8V

  • Family:

    100LVE

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    0.36 ns

  • Propagation Delay (tpd):

    0.31 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MC100LVEP11DTR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100LVEP11DTR2G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper decoupling, place a 0.1uF ceramic capacitor between the VCC pin and the GND pin, as close to the device as possible. Additionally, use a 10uF bulk capacitor between the power supply and the GND pin, located near the power supply connector.
  • The maximum operating frequency of the MC100LVEP11DTR2G is 1.5 GHz, but it can be overclocked up to 2.5 GHz with proper PCB design and decoupling.
  • The MC100LVEP11DTR2G has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB. Additionally, ensure good airflow around the device to prevent overheating.
  • The recommended input signal amplitude for the MC100LVEP11DTR2G is between 100mV and 1V peak-to-peak, depending on the specific application and frequency of operation.

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Part Image MC100LVEP11DTG onsemi

Low Skew Clock Driver, 100LVE Series, 2 True Output(s), 0 Inverted Output(s), ECL, PDSO8