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MC100LVEP11MNR4G - onsemi

Description: Open Input Default State; 240 ps Typical Propagation Delay; Q Outputs will default LOW with inputs open or at VEE; Maximum Frequency > 3 GHz Typical; PECL Mode Operating Range: VCC= 2.375 V to 3.8 V with VEE= 0 V; NECL Mode Operating Range: VCC= 0 V with VEE= -2.375 V to -3.8 V; LVDS Input Compatible

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MC100LVEP11MNR4G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 2x2, 0.5P
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MC100LVEP11MNR4G - onsemi  - 3D model - Small Outline No-lead - DFN8 2x2, 0.5P
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MC100LVEP11MNR4G Details

  • Manufacturer Part Number:

    MC100LVEP11MNR4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN8 2.0x2.0x0.9mm, 0.5p

  • Pin Count:

    8

  • Manufacturer Package Code:

    506AA

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Additional Feature:

    NECL MODE : VCC = 0V WITH VEE = -2.375V TO -3.8V

  • Family:

    100LVE

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XDSO-N8

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    0.36 ns

  • Propagation Delay (tpd):

    0.31 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

MC100LVEP11MNR4G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use termination resistors as close to the device as possible. Also, use a solid ground plane and decouple the power supply with capacitors.
  • The recommended power-up sequence is to apply VCC first, followed by VCCA, and then the input signals. This ensures that the internal voltage regulators are powered up correctly.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Also, follow proper handling and storage procedures to prevent ESD damage.
  • The maximum operating temperature range for the MC100LVEP11MNR4G is -40°C to 125°C. However, the device may not meet its specified performance at the extreme temperatures, so it's recommended to operate within a narrower temperature range for optimal performance.

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