MC10XS4200DFK - NXP

MC10XS4200DFK Details

• Manufacturer Part Number:

  MC10XS4200DFK

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  PQFN-23

• Country Of Origin:

  Mainland China

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  26 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Built-in Protections:

  TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

• Driver Number of Bits:

  2

• Interface IC Type:

  BUFFER OR INVERTER BASED PERIPHERAL DRIVER

• JESD-30 Code:

  S-PQCC-N23

• Length:

  12 mm

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  23

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output Characteristics:

  OPEN-DRAIN

• Output Current Flow Direction:

  SINK

• Output Current-Max:

  8.5 A

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HQCCN

• Package Equivalence Code:

  LCC23(UNSPEC)

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  2.2 mm

• Supply Current-Max:

  8.5 mA

• Supply Voltage-Max:

  36 V

• Supply Voltage-Min:

  8 V

• Supply Voltage-Nom:

  24 V

• Surface Mount:

  YES

• Terminal Form:

  NO LEAD

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Turn-off Time:

  245 µs

• Turn-on Time:

  245 µs

• Width:

  12 mm