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MC14094BDR2G - onsemi

Description: Useful for Serial-to-Parallel Data Conversion; Pin-for-Pin Compatible with CD4094B; Data Latch; Input Diode Protection; Dual Outputs for Data Out on Both Positive and Negative Clock Transitions; Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load Over the Rated Temperature Range; Three-State Outputs; Pb-Free Packages are Available*

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MC14094BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 CASE751B-05
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MC14094BDR2G - onsemi  - 3D model - Small Outline Packages - SOIC-16 CASE751B-05
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MC14094BDR2G Details

  • Manufacturer Part Number:

    MC14094BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Count Direction:

    RIGHT

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    SERIAL IN PARALLEL OUT

  • Max Frequency@Nom-Sup:

    1250000 Hz

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    840 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    3.9 mm

  • fmax-Min:

    3 MHz

MC14094BDR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC14094BDR2G is 4.5V to 18V, although it can operate up to 20V with reduced performance.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 0.1uF capacitor to ground. Additionally, connect the VEE pin to a stable voltage source or ground, depending on the application.
  • The maximum power dissipation for the MC14094BDR2G is 625mW, and it's essential to ensure the device operates within this limit to prevent overheating and damage.
  • While the MC14094BDR2G is not designed for high-frequency applications, it can operate up to 10MHz. However, it's essential to consider the device's bandwidth, slew rate, and propagation delay when designing high-frequency circuits.
  • To prevent electrostatic discharge (ESD) damage, handle the MC14094BDR2G by the body, avoid touching the pins, and use an anti-static wrist strap or mat. Also, ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays.

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Part Image MC14094BDR2 Rochester Electronics LLC

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