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MC14175BDR2G - onsemi

Description: Flip Flop 1 Element D-Type 4 Bit Positive Edge 16-SOIC (0.154", 3.90mm Width)

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MC14175BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 9.90x3.90x1.37 1.27P CASE 751B ISSUE M
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MC14175BDR2G - onsemi  - 3D model - Small Outline Packages - SOIC−16 9.90x3.90x1.37 1.27P CASE 751B ISSUE M
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MC14175BDR2G Details

  • Manufacturer Part Number:

    MC14175BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D FLIP-FLOP

  • Max Frequency@Nom-Sup:

    2000000 Hz

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    400 ns

  • Propagation Delay (tpd):

    400 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    3.9 mm

  • fmax-Min:

    6.5 MHz

MC14175BDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC14175BDR2G involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 0.1uF capacitor to ground. The input voltage range is 2.7V to 5.5V, and the recommended operating voltage is 3.3V or 5V. Ensure the input voltage is stable and noise-free.
  • The MC14175BDR2G can sink or source up to 32mA of current per channel. However, it's recommended to limit the current to 20mA per channel to ensure reliable operation and to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines. Add a voltage clamp or a zener diode to protect against overvoltage. Ensure the PCB layout is designed to minimize ESD susceptibility.
  • The recommended operating temperature range for the MC14175BDR2G is -40°C to 125°C. However, the device can operate up to 150°C for short periods of time. Ensure proper thermal management to prevent overheating.

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MC14175BDR2G Overview

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