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MC14511BDWR2G - onsemi

Description: Chip Complexity: 216 FETs or 54 Equivalent Gates; High-Current Sourcing Outputs (Up to 25 mA); Latch Storage of Code; Time Share (Multiplexing) Facility; Lamp Test Provision; Low Logic Circuit Power Dissipation; Supply Voltage Range = 3.0 V to 18 V; Lamp Intensity Modulation Capability; Triple Diode Protection on all Inputs; Readout Blanking on all Illegal Input Combinations; Blanking Input; Capable of Driving Two Low-power TTL Loads, One Low-power Schottky TTL Load or Two HTL Loads Over the Rated Temperatu

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MC14511BDWR2G - onsemi - PCB symbol
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MC14511BDWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 WB CASE 751G-03 ISSUE D
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MC14511BDWR2G - onsemi - 3D model - Small Outline Packages - SOIC-16 WB CASE 751G-03 ISSUE D
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MC14511BDWR2G Details

  • Manufacturer Part Number:

    MC14511BDWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-16 WB

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751G-03

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.5

  • Family:

    CMOS

  • Input Conditioning:

    LATCHED

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    SEVEN SEGMENT DECODER/DRIVER

  • Max I(ol):

    0.0024 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    1440 ns

  • Propagation Delay (tpd):

    1440 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MC14511BDWR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC14511BDWR2G is 2.7V to 5.5V.
  • To ensure reliable operation in high-temperature environments, it is recommended to operate the device within the specified temperature range (-40°C to 125°C) and ensure proper thermal management, such as using a heat sink or thermal pad.
  • The maximum clock frequency supported by the MC14511BDWR2G is 2.5 MHz.
  • The POR and BOR features of the MC14511BDWR2G can be handled by ensuring a stable power supply, using a capacitor to filter out noise, and implementing a reset circuit to handle power-on and brown-out conditions.
  • The internal pull-up resistors on the I/O pins of the MC14511BDWR2G are used to reduce the power consumption and noise sensitivity of the device, and to simplify the design of the external circuitry.

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MC14511BDWR2G Overview

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