MC17XSG500BEK - NXP

MC17XSG500BEK Details

• Manufacturer Part Number:

  MC17XSG500BEK

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  SOIC-32

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.60

• Date Of Intro:

  2018-07-16

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Additional Feature:

  ALSO OPERATES AT 7V TO 30V

• Built-in Protections:

  OVER CURRENT; THERMAL; UNDER VOLTAGE

• Driver Number of Bits:

  6

• Input Characteristics:

  STANDARD

• Interface IC Type:

  BUFFER OR INVERTER BASED PERIPHERAL DRIVER

• JESD-30 Code:

  R-PDSO-G32

• JESD-609 Code:

  e3

• Length:

  11 mm

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  32

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output Characteristics:

  OPEN-DRAIN

• Output Current Flow Direction:

  SINK

• Output Peak Current Limit-Nom:

  11 A

• Output Polarity:

  TRUE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HSSOP

• Package Equivalence Code:

  SSOP32,.4

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

• Packing Method:

  TUBE

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  2.45 mm

• Supply Current-Max:

  4 mA

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  4.5 V

• Supply Voltage-Nom:

  5 V

• Supply Voltage1-Max:

  30 V

• Supply Voltage1-Min:

  7 V

• Supply Voltage1-Nom:

  24 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Turn-off Time:

  120000 µs

• Turn-on Time:

  120000 µs

• Width:

  7.5 mm