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MC33152DG - onsemi

Description: Output Rise and Fall Times of 15 ns with 1000 pF Load; CMOS/LSTTL Compatible Inputs with Hysteresis; Low Standby Current; Two Independent Channels with 1.5 A Totem Pole Outputs; Undervoltage Lockout with Hysteresis; Efficient High Frequency Operation; Enhanced System Performance with Common Switching Regulator Control ICs; Pb-Free Packages are Available

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MC33152DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
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MC33152DG - onsemi  - 3D model - Small Outline Packages - SOIC-8
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MC33152DG Details

  • Manufacturer Part Number:

    MC33152DG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    1.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    6.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.12 µs

  • Turn-on Time:

    0.12 µs

  • Width:

    3.9 mm

MC33152DG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33152DG involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a shielded inductor and to keep the device away from high-frequency components.
  • To ensure the MC33152DG operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive temperatures, and the input voltage is within the recommended range. Also, ensure the output current is within the specified limit to prevent overheating.
  • The recommended input capacitor value for the MC33152DG is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended to minimize voltage ripple and ensure stable operation.
  • To troubleshoot issues with the MC33152DG, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for any signs of overheating, such as excessive temperature or burning smells. Use an oscilloscope to check for voltage ripple or oscillations. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the MC33152DG is suitable for high-reliability and automotive applications. It is AEC-Q100 qualified and meets the requirements for automotive applications. However, it's essential to follow the recommended operating conditions, PCB layout, and thermal management guidelines to ensure reliable operation in these applications.

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MC33152DG Overview

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