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MC33172N - STMicroelectronics

Description: Standard (General Purpose) Amplifier 2 Circuit 8-Mini DIP

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MC33172N - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP8_2021
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MC33172N - STMicroelectronics  - 3D model - Dual-In-Line Packages - DIP8_2021
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MC33172N Details

  • Manufacturer Part Number:

    MC33172N

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    1.6 V/us

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2100

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    7.62 mm

MC33172N Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33172N involves keeping the input and output tracks separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a Kelvin connection for the sense pins to minimize errors.
  • To ensure accurate current sensing, it's essential to use a low-impedance sense resistor, keep the sense lines short and twisted, and avoid routing high-current or high-frequency signals near the sense lines. Also, make sure to follow the recommended layout and grounding guidelines.
  • The MC33172N can operate from -40°C to 125°C, but the accuracy and linearity of the device may degrade at extreme temperatures. It's recommended to operate the device within the specified temperature range for optimal performance.
  • Yes, the MC33172N can be used for high-side current sensing, but it requires an external voltage regulator to power the device. The regulator should be able to handle the voltage drop across the sense resistor and provide a stable voltage supply to the device.
  • The sense resistor value can be calculated using the formula: Rsense = (Vref / Iout) x (Ratiometric Accuracy / 100), where Vref is the reference voltage, Iout is the output current, and Ratiometric Accuracy is the desired accuracy in percentage.

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MC33172N Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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