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MC33172VDR2G - onsemi

Description: Large Output Voltage Swing: -14.2 V to +14.2 V (with +/-15 V Supplies); Low Supply Current: 180 µA (Per Amplifier); Output Short Circuit Protection; Excellent Gain Margin: 15 dB; Low Input Offset Voltage: 2.0 mV; Wide Supply Operating Range: 3.0 V to 44 V or +/-1.5 V to +/- 22 V; Wide Input Common Mode Range, Including Ground (VEE); Excellent Phase Margin: 60 C°; ESD Diodes Provide Input Protection for Dual and Quad; High Slew Rate: 2.1 V/µs; Low Total Harmonic Distortion: 0.03%; Wide Bandwidth: 1.8 MHz; La

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MC33172VDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC33172VDR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC33172VDR2G Details

  • Manufacturer Part Number:

    MC33172VDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.6 V/us

  • Slew Rate-Nom:

    2.1 V/us

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1800

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

MC33172VDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33172VDR2G involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is operated within the recommended temperature range. Additionally, a minimum ESR (Equivalent Series Resistance) of 0.1 ohms is recommended for the output capacitor.
  • The MC33172VDR2G is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. Consult the datasheet for thermal resistance and power dissipation calculations.
  • Yes, the MC33172VDR2G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using automotive-grade processes.
  • Power dissipation can be calculated using the formula: Pd = (Vin x Iin) + (Vout x Iout). Consult the datasheet for thermal resistance and power dissipation calculations to ensure the device operates within its recommended temperature range.

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