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MC33178DMR2G - onsemi

Description: High Gain Bandwidth: 5.0 MHz; High Slew Rate: 2.0 V/µs; ESD Clamps on the Inputs Increase Ruggedness without Affecting Device Performance; Low T.C. of Input Offset Voltage: 2.0 ?V/°C; Low Total Harmonic Distortion: 0.0024% (@ 1.0 kHz w/600 W Load); Dual Supply Operation: +/-2.0 V to +/-18 V; Large Output Voltage Swing; Low Offset Voltage: 0.15 mV (Mean); 600 W Output Drive Capability

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MC33178DMR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Micro8 CASE 846A−02
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MC33178DMR2G - onsemi  - 3D model - Small Outline Packages - Micro8 CASE 846A−02
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MC33178DMR2G Details

  • Manufacturer Part Number:

    MC33178DMR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Micro 8 lead Surface Mount

  • Package Description:

    MICRO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    846A-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.6 µA

  • Bias Current-Max (IIB) @25C:

    0.5 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1.2 V/us

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3 mm

MC33178DMR2G Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a reference design would be helpful.
  • The datasheet provides some information on biasing, but it's essential to follow the recommended biasing scheme and ensure the input voltage is within the specified range. Additionally, consider using a voltage regulator to maintain a stable input voltage.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, decreased reliability, and potentially even damage to the device. It's essential to ensure the device operates within the specified temperature range to maintain optimal performance and reliability.
  • To troubleshoot issues, start by verifying the PCB layout, ensuring proper decoupling, and checking the input voltage. If issues persist, consult the datasheet and application notes for guidance. If necessary, contact onsemi's technical support for further assistance.
  • The device is designed to meet EMI and EMC standards, but it's essential to follow proper PCB design and layout practices to minimize emissions and susceptibility. Consider using shielding, filtering, and grounding techniques to ensure compliance with relevant standards.

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