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MC33201DR2G - onsemi

Description: Low Supply Current (ID = 0.9 mA, Typ); Extended Operating Temperature Ranges (-40° to +105°C and -55° to +125°C); Output Voltage Swings within 50 mV of both Rails; Input Voltage Range Includes both Supply Rails; Low Voltage, Single Supply Operation (+1.8 V and Ground to +12 V and Ground); No Phase Reversal on the Output for Over-driven Input Signals; High Output Current (ISC = 80 mA, Typ); Typical Gain Bandwidth Product = 2.2 MHz; 600 W Output Drive Capability

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MC33201DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - --SOIC8 CASE 75Z1EB ISSUE A
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MC33201DR2G - onsemi  - 3D model - Small Outline Packages - --SOIC8 CASE 75Z1EB ISSUE A
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MC33201DR2G Details

  • Manufacturer Part Number:

    MC33201DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.2 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    1.125 mA

  • Supply Voltage Limit-Max:

    13 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2200

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

MC33201DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33201DR2G involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a shielded inductor and to keep the device away from high-frequency components.
  • To ensure the MC33201DR2G operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive temperatures, and the input voltage is within the recommended range. Also, ensure the output current is within the specified maximum rating.
  • The recommended input capacitor type for the MC33201DR2G is a low-ESR ceramic capacitor with a value of 10uF to 22uF. This helps to filter out high-frequency noise and ensure stable operation.
  • To troubleshoot issues with the MC33201DR2G, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for any signs of overheating, such as excessive temperature or burning smells. If the issue persists, consult the datasheet and application notes for guidance.
  • Yes, the MC33201DR2G is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.

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MC33201DR2G Overview

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Part Image MC33201D onsemi

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