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MC33202DR2G - onsemi

Description: Low Supply Current (ID = 0.9 mA, Typ); Extended Operating Temperature Ranges (-40° to +105°C and -55° to +125°C); Output Voltage Swings within 50 mV of both Rails; Input Voltage Range Includes both Supply Rails; Low Voltage, Single Supply Operation (+1.8 V and Ground to +12 V and Ground); No Phase Reversal on the Output for Over-driven Input Signals; High Output Current (ISC = 80 mA, Typ); Typical Gain Bandwidth Product = 2.2 MHz; 600 W Output Drive Capability

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MC33202DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07
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MC33202DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07
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MC33202DR2G Details

  • Manufacturer Part Number:

    MC33202DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.2 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    11000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    2.25 mA

  • Supply Voltage Limit-Max:

    13 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2200

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

MC33202DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33202DR2G involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a shielded inductor and to keep the switching node (pin 5) away from sensitive analog circuits.
  • The inductor value depends on the input voltage, output voltage, and switching frequency. A good starting point is to use the inductor value recommended in the datasheet (e.g., 10uH). Then, adjust the value based on the specific application requirements, such as output current and ripple voltage.
  • The maximum ambient temperature for the MC33202DR2G is 125°C. However, the device can operate at higher temperatures with derating. It's essential to ensure that the device does not exceed the maximum junction temperature (Tj) of 150°C.
  • Yes, the MC33202DR2G is suitable for high-reliability applications. It's manufactured using a robust process, and onsemi provides a comprehensive set of reliability data, including FIT rates and MTBF calculations, to support high-reliability designs.
  • To troubleshoot issues with the MC33202DR2G, start by verifying the PCB layout and component values. Check for proper decoupling, correct inductor value, and adequate input and output capacitance. Use an oscilloscope to measure the switching node and output voltage waveforms. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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MC33202DR2G Overview

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