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MC33204DTBR2G - onsemi

Description: No Phase Reversal on the Output for Over-driven Input Signals; High Output Current (ISC = 80 mA, Typ); Typical Gain Bandwidth Product = 2.2 MHz; 600 Ω Output Drive Capability; Low Supply Current (ID = 0.9 mA, Typ); Extended Operating Temperature Ranges (-40° to +105°C and -55° to +125°C); Output Voltage Swings within 50 mV of both Rails; Input Voltage Range Includes both Supply Rails; Low Voltage, Single Supply Operation (+1.8 V and Ground to +12 V and Ground)

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MC33204DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14 CASE 948G-01 ISSUE B
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MC33204DTBR2G - onsemi  - 3D model - Small Outline Packages - TSSOP14 CASE 948G-01 ISSUE B
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MC33204DTBR2G Details

  • Manufacturer Part Number:

    MC33204DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.82

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.2 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    13000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage Limit-Max:

    13 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2200

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    4.4 mm

MC33204DTBR2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a large copper area to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to moisture or humidity, which can affect reliability.
  • The MC33204DTBR2G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the MC33204DTBR2G is designed to withstand vibrations up to 10g. However, it is recommended to follow proper mounting and soldering procedures to ensure reliable operation in high-vibration environments.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the device's power supply voltage and ensure that it is within the recommended range. Also, verify that the device is properly soldered and that there are no shorts or opens on the PCB.

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MC33204DTBR2G Overview

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