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MC33219AP - Motorola

Description: VOICE SWITCHED SPEAKERPHONE CIRCUIT

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PCB Footprints
MC33219AP - Motorola PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - dip-24
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3D Models
MC33219AP - Motorola  - 3D model - Dual-In-Line Packages - dip-24
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MC33219AP Details

  • Manufacturer Part Number:

    MC33219AP

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.300 INCH, PLASTIC, DIP-24

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Motorola Semiconductor Products

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDIP-T24

  • JESD-609 Code:

    e0

  • Length:

    31.69 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.44 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    SPEAKER PHONE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

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MC33219AP Overview

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Part Image MC33219AP Freescale Semiconductor

Speaker Phone Circuit, PDIP24