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MC33269DR2-3.3G - onsemi

Description: Output Current in Excess of 800 mA; 1.0 V Dropout; Short Circuit Protection; Output Trimmed to 1.0% Tolerance; Thermal Protection; 3.3 V, 5.0 V, 12 V and Adjustable Versions 2.85 V version available as MC34268.; Space Saving DPAK, SOP-8 and SOT-223 Power Packages; Pb-Free Packages are Available

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MC33269DR2-3.3G - onsemi - PCB symbol
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PCB Footprints
MC33269DR2-3.3G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC33269DR2-3.3G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC33269DR2-3.3G Details

  • Manufacturer Part Number:

    MC33269DR2-3.3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.2

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.35 V

  • Dropout Voltage1-Nom:

    1.1 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    4.8 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.0099%

  • Load Regulation-Max:

    0.0165%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.8 A

  • Output Voltage1-Max:

    3.37 V

  • Output Voltage1-Min:

    3.23 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.12%

  • Width:

    3.9 mm

MC33269DR2-3.3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33269DR2-3.3G involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the stability of the output voltage, it's essential to use the recommended output capacitor value and type, and to ensure that the output capacitor is placed close to the device. Additionally, the input voltage should be within the recommended range, and the device should be operated within the recommended temperature range.
  • The maximum ambient temperature range for the MC33269DR2-3.3G is -40°C to 125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the MC33269DR2-3.3G is suitable for high-reliability applications. It's manufactured using a high-reliability process, and it's qualified to automotive and industrial standards. However, it's essential to follow the recommended design and manufacturing guidelines to ensure the device operates reliably in the application.
  • To troubleshoot issues with the MC33269DR2-3.3G, start by checking the input voltage, output voltage, and output current. Verify that the device is operated within the recommended operating conditions, and that the PCB layout is correct. If the issue persists, check the device's thermal performance, and ensure that the device is not overheating.

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MC33269DR2-3.3G Overview

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