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MC33662BLEF - NXP

Description: Networking Development Tools Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8

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Symbol
MC33662BLEF - NXP - PCB symbol
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PCB Footprints
MC33662BLEF - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 8LD SOIC NB
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3D Models
MC33662BLEF - NXP - 3D model - Small Outline Packages - 8LD SOIC NB
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MC33662BLEF Details

  • Manufacturer Part Number:

    MC33662BLEF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

MC33662BLEF Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN4868, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and thermal dissipation.
  • The MC33662BLEF has a low-power mode that can be enabled by setting the EN pin low. Additionally, the device can be configured to enter a low-power state by setting the appropriate registers and configuring the power management unit (PMU). Refer to the datasheet and application notes for more information.
  • The MC33662BLEF is rated for operation from -40°C to 125°C (junction temperature). However, the device can be operated at a lower temperature range depending on the specific application requirements.
  • NXP provides a troubleshooting guide in the application note AN4869, which covers common issues and debugging techniques for the device's communication interfaces. Additionally, engineers can use tools like oscilloscopes and logic analyzers to debug communication issues.
  • NXP recommends using 100nF to 1uF decoupling capacitors with a voltage rating of 10V or higher, placed as close as possible to the device's power pins. The exact capacitor value and type may vary depending on the specific application and PCB layout.

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MC33662BLEF Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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