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MC33664ATL1EGR2 - NXP

Description: Interface - Specialized Isolated network high speed transceiver.

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MC33664ATL1EGR2 - NXP - PCB symbol
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PCB Footprints
MC33664ATL1EGR2 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT109-5_2026-1.5
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3D Models
MC33664ATL1EGR2 - NXP - 3D model - Small Outline Packages - SOT109-5_2026-1.5
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MC33664ATL1EGR2 Details

  • Manufacturer Part Number:

    MC33664ATL1EGR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Data Rate:

    2000 Mbps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

MC33664ATL1EGR2 Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation can help optimize the design.
  • Follow the guidelines in the datasheet for PCB layout, decoupling, and filtering. Additionally, consider using shielding, grounding, and filtering components to minimize electromagnetic interference (EMI). Consult the relevant EMC standards and regulations for your application.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, increased power consumption, and potentially even device failure. Ensure that your design takes into account the thermal and environmental conditions in which the device will operate.
  • Consult the datasheet and application notes for troubleshooting guidelines. Use oscilloscopes, logic analyzers, and other diagnostic tools to identify the root cause of the issue. If necessary, contact NXP Semiconductors' technical support for further assistance.
  • The MC33664ATL1EGR2 is designed to operate with a specific voltage range. Using a different voltage regulator or power supply may affect the device's performance, power consumption, or even cause damage. Ensure that the power supply meets the recommended voltage and current requirements.

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MC33664ATL1EGR2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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