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MC33797BPEW - NXP

Description: IC INTERFACE SPECIALIZED 32SOIC

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MC33797BPEW - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT1762-1
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MC33797BPEW - NXP  - 3D model - Small Outline Packages - SOT1762-1
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MC33797BPEW Details

  • Manufacturer Part Number:

    MC33797BPEW

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SOIC-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC33797BPEW Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN4869, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • The MC33797BPEW has a low-power mode that can be enabled by setting the EN pin low. Additionally, the device can be configured for low-power mode by programming the registers through the I2C interface. Refer to the datasheet section 10.3 for more information.
  • The maximum current rating for the output stages is 1.5A per channel. However, the actual current capability may be limited by the PCB design, thermal performance, and other system-level factors. It's essential to perform thermal analysis and simulation to ensure the device operates within its safe operating area.
  • The MC33797BPEW is rated for operation up to 150°C. However, the device's performance and reliability may degrade at high temperatures. It's crucial to perform thermal analysis and consider the device's thermal derating when operating in high-temperature environments.
  • To troubleshoot I2C interface issues, check the I2C bus voltage levels, clock frequency, and signal integrity. Ensure that the I2C bus is properly terminated, and the device is properly addressed. Use an oscilloscope or logic analyzer to debug the I2C communication. Refer to the datasheet section 9.3 for more information.

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MC33797BPEW Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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