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MC33812EK - NXP

Description: Motor/Motion/Ignition Controllers & Drivers Engine Control IC, One Cylinder, Electronic fuel injection (EFI), SOIC 32

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PCB Footprints
MC33812EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32 SOICW-EP
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MC33812EK - NXP  - 3D model - Small Outline Packages - 32 SOICW-EP
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MC33812EK Details

  • Manufacturer Part Number:

    MC33812EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2016-04-12

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SOP32,.4,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    14 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC33812EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the MC33812EK application note (AN4831) which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • The MC33812EK is a general-purpose motor driver, and its configuration depends on the specific motor type and application. NXP provides application notes and example code for different motor types, such as AN4832 for brushed DC motors and AN4833 for stepper motors. Additionally, the device's registers can be programmed using the SPI interface to customize the driver's behavior for a specific motor.
  • The MC33812EK has a maximum current rating of 5A per channel, and it has built-in overcurrent protection (OCP) and short-circuit protection (SCP) features. The device can detect overcurrent conditions and respond by limiting the current, shutting down the driver, or triggering an interrupt to the microcontroller. The OCP and SCP thresholds can be programmed using the device's registers.
  • The MC33812EK provides several status registers and interrupts that can be used to detect and diagnose faults, such as overcurrent, overtemperature, and undervoltage conditions. The device's status registers can be read using the SPI interface, and interrupts can be configured to trigger an interrupt to the microcontroller when a fault occurs. NXP provides example code and application notes that demonstrate how to implement fault detection and diagnosis using the MC33812EK.
  • NXP recommends using a combination of ceramic capacitors and ferrite beads to decouple and filter the power supply to the MC33812EK. A 10uF ceramic capacitor should be placed close to the device's power pins, and a ferrite bead should be used in series with the power supply to filter out high-frequency noise. Additionally, the PCB layout should be designed to minimize loop areas and reduce EMI radiation.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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