MC33GD3100B3EK - NXP

MC33GD3100B3EK Details

• Manufacturer Part Number:

  MC33GD3100B3EK

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  SOIC-32

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.60

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• High Side Driver:

  YES

• Interface IC Type:

  BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

• JESD-30 Code:

  R-PDSO-G32

• Length:

  11 mm

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  32

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output Peak Current Limit-Nom:

  15 A

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SSOP

• Package Equivalence Code:

  SSOP32,.4

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  2.65 mm

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  7.5 mm