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MC33PT2001AE - NXP

Description: Power Management Specialized - PMIC Programmable solenoid controller, 6 - solenoid driver, precision control, LQFP 64, Reel

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PCB Footprints
MC33PT2001AE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1510-1_2025
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3D Models
MC33PT2001AE - NXP  - 3D model - Quad Flat Packages - SOT1510-1_2025
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MC33PT2001AE Details

  • Manufacturer Part Number:

    MC33PT2001AE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HLQFP-64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-05-14

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

MC33PT2001AE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the device, and use a Kelvin connection for the sense resistors.
  • Use the provided compensation network calculation tool or consult the application note AN12241 for guidance on selecting the correct compensation components based on the specific application requirements.
  • The maximum allowed voltage on the EN pin is 6V. Use a voltage divider or a Zener diode to limit the voltage to the EN pin, especially when the input voltage is higher than 6V.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and consider using a thermal interface material to improve heat transfer.
  • Use a common-mode choke and a differential-mode filter to reduce EMI emissions. Ensure the filter components are placed close to the device and the PCB layout is optimized for EMI reduction.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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