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MC33XS2410EL - NXP

Description: Power Management Specialized - PMIC High Side Switch, 24V, 100mOhm, SPI & integrated A/D, TSSOP28, Rail

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MC33XS2410EL - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT1172-4
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MC33XS2410EL - NXP  - 3D model - Small Outline Packages - SOT1172-4
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MC33XS2410EL Details

  • Manufacturer Part Number:

    MC33XS2410EL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSSOP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; SHORTCIRCUIT; OVERLOAD

  • Driver Number of Bits:

    4

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    3.6 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    60 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    28 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    58 µs

  • Turn-on Time:

    58 µs

  • Width:

    4.4 mm

MC33XS2410EL Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33XS2410EL involves placing the device near the battery, using a solid ground plane, and keeping the power traces short and wide. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To optimize the performance of the MC33XS2410EL in a noisy environment, use a low-pass filter on the input, add a ferrite bead or a common-mode choke on the power lines, and use a shielded cable for the battery connection. Additionally, consider using a noise filter capacitor on the output.
  • The MC33XS2410EL can handle input voltages up to 18V, but it's recommended to keep the input voltage below 16V to ensure reliable operation and to prevent damage to the device.
  • To ensure the stability of the output voltage, use a high-quality output capacitor with a low ESR, keep the output capacitor close to the device, and use a low-ESR input capacitor. Additionally, ensure that the input voltage is stable and within the recommended range.
  • The MC33XS2410EL is rated for operation up to 125°C, but it's recommended to derate the device's performance at high temperatures. Ensure that the device is properly cooled, and consider using a heat sink or a thermal interface material to improve heat dissipation.

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MC33XS2410EL Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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