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MC33XS2410ELR2 - NXP

Description: Power Management Specialized - PMIC High Side Switch, 24V, 100mOhm, SPI & integrated A/D, TSSOP28, Rail

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MC33XS2410ELR2 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT1172-4
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MC33XS2410ELR2 - NXP  - 3D model - Small Outline Packages - SOT1172-4
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MC33XS2410ELR2 Details

  • Manufacturer Part Number:

    MC33XS2410ELR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSSOP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; SHORTCIRCUIT; OVERLOAD

  • Driver Number of Bits:

    4

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    60 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    28 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    58 µs

  • Turn-on Time:

    58 µs

  • Width:

    4.4 mm

MC33XS2410ELR2 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33XS2410ELR2 has multiple low-power modes, including shutdown, standby, and sleep modes. To configure the device for low-power mode, refer to the device's datasheet and application notes, which provide detailed information on the required register settings and pin configurations.
  • The MC33XS2410ELR2 is rated for operation from -40°C to 125°C, making it suitable for automotive and industrial applications. However, it's essential to ensure proper thermal management and follow the recommended PCB layout to maintain optimal performance within this temperature range.
  • Yes, the MC33XS2410ELR2 is not limited to automotive applications. Its features and performance make it suitable for various industrial, consumer, and IoT applications, such as power supplies, motor control, and battery management systems.
  • To troubleshoot issues with the internal oscillator, refer to the device's datasheet and application notes, which provide guidance on oscillator configuration, frequency selection, and troubleshooting techniques. Additionally, NXP's support resources, such as forums and technical support teams, can provide further assistance.

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MC33XS2410ELR2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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